Information about thermal paste in our laptops

Phase Transition Material (PTM)

Since 2025, all newly introduced XMG and SCHENKER models have been equipped with PTM7950 phase change thermal interface material by default, or with PTM7958, which is technically the same product. These materials combine the high thermal conductivity of classic high-performance thermal pastes with particularly stable, pump-out resistant long-term performance.

The introduction of PTM7950 began in 2024 in selected models, after some of our top models had used liquid metal between 2020 and 2024. In 2024, we gradually switched from liquid metal to Honeywell PTM7950 in order to further improve maintainability, reliability and thermal stability in mass production, while maintaining strong thermal performance.

PTM7950 is easier to handle, electrically non-conductive and still provides highly effective cooling, as it becomes semi-liquid at higher temperatures.

PTM7950 tolerates hotspots better than liquid metal and is therefore more suitable for CPU architectures with E/P-core design, where the temperature differences between hotspots and average die temperatures are much larger than in traditional CPU designs.

Thermal putty

A special product called "Thermal Putty" (or thermal paste or gel) is now used on components such as VRAM and MOSFETs in most models. This material replaces traditional thermal pads and can much better compensate the differences in height between the thermal module and the numerous chips.

This ensures that every memory chip, voltage regulator and power stage has reliable contact with the cooling module, without affecting the contact pressure on the CPU or GPU. For mass production, thermal putty offers the best combination of contact surface, production tolerance and long-term stability, even when facing slight deformation during operation.

Older models

Older models used high-quality thermal pastes based on silicone or, in some cases, graphene from established industrial suppliers (e.g. Shin-Etsu, M.G., Thermaless). Although these products rarely have well-known consumer brand names, they were also designed for high thermal conductivity, robust production tolerances and long-term reliability.

Overview

We provide a model specific overview of which thermal interface material (TIM) is used in which device here:

• XMG and SCHENKER Thermal Interface Overview

All thermal interface materials are machine-applied by the supplier who manufactures the heatpipe modules for us, and are subject to comprehensive quality control. After final assembly in Germany, we additionally check the thermal performance using automated stress tests and temperature measurements.